With this technology, the LED chips are in the form of a semiconductor chip (die) size between 100~200 micron. The individual chips are placed on the ceramic substrate PCB and using the Wire Bonding method, connected to the contact surface of the ceramic substrate PCB. Gold wires in the micrometer range are used for contacting the semiconductor chip and the substrate. The COB technology allows for virtually limitless *** of scope for the PCBs and thus serves as the basis for totally unique LED soluti***. Furthermore Lumiere is using ceramic as substrate of which will improve the internal quantum efficiency and increase heat dissipation. The careful design of the ceramic PCB and selection of quality dies in c***equences minimize electrical losses and light extraction on the dies and improve the LED efficiency.

1.高熱導(dǎo)陶瓷基板，芯片所產(chǎn)生的熱量可迅速通過陶瓷基板向外傳導(dǎo)

2.高顯色指數(shù)，高發(fā)光效率發(fā)光均勻，

3.光線柔和，無眩光，無光斑高可靠性，額定工作電流下，5000小時(shí)衰減低于3%

4..發(fā)光均勻，光線柔和，無眩光，無光斑 5..組裝方便，可自由搭配和組合，無需PCB板，直接接觸散熱片。