PCB Model | BGA Board (Multilayer PCBs) |
Base Material | FR4 |
Layer | 8L |
Surface Finish | Immersion Gold |
Profile | CNC |
Min Hole dia | 0,1 mm |
Min Track width | 0,1 mm |
Min Track space | 0,1 mm |
Soldermask | Green |
Copper thickness | 1oz. (=35um) |
Special Procedure | blind/buried via |